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Electronic
Assembly
InnerStep’s printed
circuit board assembly experience is one of our core competencies.
Our capabilities in PCB assembly include:
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BGA
placement, X-ray inspection, ball/deball and rework capability
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High and
low Volume fine pitch placement (Siemens, Fuji, Zevatech & Mydata).
Placement of 0201 passive components
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Semi and
full automatic through-hole Insertion
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Lead and Lead-Free processes
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Clean and no-clean processes
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Wide
format PCB’s, rigid-flex, metal back and
RF substrates
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IPC Class
II and III, J-STD-001 Standards
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ICT and Flying probe on
Genrad, HP and Teradyne platforms
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